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NASA Organic Inventory Template
Organic Inventory | Mission Name: |
To be in compliance with planetary protection policy, the Mission shall provide an itemized list of bulk organic materials (defined as; all carbon-containing compounds including payload biological materials but excluding carbides, carbonates, cyanides and simple oxides of carbon [i.e., CO and CO2]) presented at the same level as the MIUL/materials list, as used on the flight hardware, estimated actual (in kg) for organic materials present in amounts larger than 1kg; “small amounts” for organic materials present in amounts between 1kg and 0.1kg, and; “traces” for identifiable organic materials present in amounts less than 0.1kg (Add more lines as needed for each line entry).
1) Adhesives and Potting Compounds
e.g., RTV/Silicones (DOW, Nusil, Hysol); polyurethanes such as arathane/solithane conformal coatings; epoxies such as Scotchweld, CFRP resin.
Material Name and Usage | Actual Amount (kg) | Small Amount | Traces |
0.0 | |||
0.0 |
2) Primers, Paints and Inks
e.g. Aeroglaze Chemglaze etc.
Material Name and Usage | Actual Amount (kg) | Small Amount | Traces |
0.0 | |||
0.0 |
3) Thermal Control Films
e.g., Kapton, FEP Teflon, Betacloth
Material Name and Usage | Actual Amount (kg) | Small Amount | Traces |
0.0 | |||
0.0 |
4) Lubricants
e.g. Braycote Molybdenum Disulfide dry film
Material Name and Usage | Actual Amount (kg) | Small Amount | Traces |
0.0 | |||
0.0 |
5) Plastics and Elastomeric Materials
e.g., Circuit board with PTFE GI polyimide resin (PWB or PCB); Wiring Overwraps: Silicones Kapton (polyimide); PEI (polyether imide); ETFE (tefzel); Nylon (polyamide); PTFE (teflon); Heat Shrink: Polyolefin or Polyvyniline Fluoride types; O-rings and seals with ethyl, propyl, butyl and Viton Rubber; Fluorosilicone Flectron Tape (polyester), EMI shielding including e.g.,Vespel (SP-1).
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NOTE: This “NASA Organic Inventory Template” was provided to the Committee on Planetary Protection by NASA Office of Planetary Protection in the Office of Safety and Mission Assurance.
Material Name and Usage |
Actual Amount (kg) | Small Amount | Traces | |
0.0 | |||
0.0 |
6) Tapes
Adhesive Tapes are principally represented by kapton (polyimide), polyester, FEP and Teflon backings with acrylic or silicone adhesives
Material Name and Usage | Actual Amount (kg) | Small Amount | Traces |
0.0 | |||
0.0 |
7) Other
A range of other materials will need to be included, including e.g., Lacing Tape and Cards, Thread, Fibers such as Nomex, Dacron Scrim Cloth (polyester); DAP, Ultem PEI, PPS bulk castings; Nylon (Polyamide) used in structures; fiber, Velcro and vibe pads; propellant (MMH, UDMH); payload biological materials (living or dead).
Material Name and Usage | Actual Amount (kg) | Small Amount | Traces |
0.0 | |||
0.0 |
OSMA/OPP/20190909