Combat Hybrid Power System Component Technologies Technical Challenges and Research Priorities (2002) / Chapter Skim
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Executive Summary
Executive Summary
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, generator, motors, converters, power distribution systems, storage, fault protection, safety systems, and auxiliary power connections. While some of the technologies required to support combat hybrid vehicle power systems are in hand, many technical challenges remain.
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design parameters quantitatively linked to changes in overall system performance Optimizing ., . auxiliary power unit, battery, and other energy storage device characteristics to meet the torquespeed requirements of the drive L ., R&D Priorities Expansion of current research to validate models and link motor design programs with power electronics and drive simulation programs Motor and inverter technology development to meet wide constant horsepower speed range without impacting the size of inverters Comparison of various power train ~ .
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Materials for electric Electrical losses in Low loss even at Low loss materials that can be motors copper windings high frequencies readily manufactured in laminar and iron in form magnetic materials Buried permanent Retention of remnant Techniques for injecting magnet rotors for flux density and magnetic materials into the large machines energy product rotors, and curing and characteristics magnetizing them on-site Power devices and Inverters that High-current, high- Development of wideband gap inverters operate with high voltage switching materials such es SiC efficiency at higher characteristics power Improving device Development of thermal cooling management systems with phase transition and other materials to remove heat quickly from the power devices and inverters and improve transient performance Reducing Integration of SiC diodes with electromagnetic insulated gate bipolar transistor interference (EMI) hard switched inverters to reduce reverse recovery transients to yield low EMI and high efficiency comparable to soft switching inverters DC bus capacitors Keeping the Size, efficiency, Fundamental research on · voltage ripple operating materials to meet these within specified temperature, and requirements limits ripple current carrying capacity DC/DC converters High ratio voltage Performance at high Design tools for optimizing the conversion at high power, combination of devices required power EMI/electromagnetic end other characteristics, e.g., compliance switching frequency shielding, and packaging size Integrated thermal Adequate cooling Cooling efficiency, Development of high thermal management systems for both motors and packaging size conductivity materials such as power electronics graphite foams and silicon carbide, in combination with phase transition fluids 3
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Voltage drop caused by limited chemical reactivity at the interface Voltage drop caused by mass transfer overpotential Ohmic resistance of materials R&D Priorities Triple the power and energy with nanomaterials technology and new chemistries Increased safety (eliminate flammable materials; better packing for isolation, containment, venting; thermally stable materials; diagnostics/ prognostics integrated in pack; eliminate ground fault and arcing; improved materials that reduce gassing) Advanced electrode/electrolyte materials with high surface reactivity Increased electrode surface area by increased matrix porosity or perhaps application of nanomaterials Electrolytes with high concentrations of reactant species and low ion transfer resistance Minimized resistance Low-resistance materials 4
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a-plane crystal orientation improve ohmic contact fabrication processes Development of packaging that can accommodate the high-temperature, high-power characteristics of wideband gap devices while providing high rates of heat removal Improvement of substrate material quality Contact stability under extreme conditions Stability, heat removal rate Improvement of science and technology of implantation, implantation activation, and metal-semiconductor metallurgy in wideband gap devices and materials For SiC devices, development of processes for high-resistivity poly SiC with a matched coefficient of thermal expansion Low defect density Fundamental processing research to control defects in bulk GaN and AlN .¢ s
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TABLE ES-4 High-power Switching Technologies System/Component Power converters Technical Challenge Higher power densities, switching frequencies, and greater reliability Performance Metrics High power density R&D Priorities Manufacturing simplicity Reduced design and verification cycle times Power electronics for pulse energy storage Power distribution network , Effective decoupling of pulse loads from the power distribution system Mission-critical systems that degrade gracefully under fault conditions Processes for integration of distributed components with active devices High current density High level of decoupling Level of functionality under unplanned faults and component failures Design tools for threedimensional thermal management' packaging, system design' and manufacturability Development of storage system interfaces with bimodal (slow and fast) power transfer capability Development of interfaces with flexibility to tailor output voltage/current waveforms to requirements of weapons systems Fundamental understanding of factors affecting system stability Dynamic models of power converter interactions at the DC bus Controls that mitigate instabilities on the DC bus 6
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TABLE ES-5 Capacitor Technologies Component/System Polymer film capacitors Technical Challenges Films with improved dielectric properties Performance Metrics Dielectric constant Dielectric withstand R&D Priorities . New polymer films with increased dielectric constant and dielectric withstand similar to biaxially oriented polypropylene Ceramic capacitors Double layer capacitors Filled polymer films: either inorganic filler to improve dielectric strength, high dielectric constant filler to increase dielectric constant, or high dielectric polymer filler to reduce volume within the film, resulting in a combination of increased operating field and increased dielectric constant Lack of understanding of aging/failure mechanisms Dielectrics with improved properties Dielectric constant Dielectric withstand Improved operating Operating field electric field Lack of understanding of aging and degradation processes at high temperature Improvement of properties of electrolytes, increase in cell voltage, and reduction of equivalent series resistance Predictability of performance over time Research on aging/failure mechanisms under hightemperature, high-field conditions Research to improve high energy density, hightemperature ceramic dielectrics Ceramic-polymer composites or other technologies that reduce the free volume within the ceramic Investigate role of impurities in the carbon electrodes and interactions among the electrodes, electrolyte, and separator Cell voltage equivalent series resistance Stability of properties Materials and processes that achieve reproducible cell characteristics that are stable over time, or age uniformly 7
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Explore use of NRMM and related software tools such as a route analysis tool kit to generate input data for CHPSET Expand executable CHPSET code to include additional user options such as parallel hybrid and conventional vehicles, with appropriate user documentation 8
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Incorporation of CHPSET codes into failure modes and effects analysis (FMEA) Design-specific, skidmounted hardware emulators of Future Combat System Enhancement of system reliability and mitigation of effect of component failures Enhancement of emulator fidelity Risk priority numbers Resemblance of emulation hardware to notional, demonstrator-level hardware Identification of potential failure modes Development of design specifics for notional, demonstrator-level systems 9
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