Frontiers in Chemical Engineering Research Needs and Opportunities (1988) / Chapter Skim
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4 Electronic, Photonic, and Recording Materials and Devices
4 Electronic, Photonic, and Recording Materials and Devices
Pages 37-60
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From page 38... ...
Worldwide, however, many high-technology industries, such as microelectronics, still have surprisingly little strength in chemical processing and engineering. The United States has a particular advantage over its international competitors in that its chemical engineering research TABLE 4.1 Worldwide Market for Materials and Devices for Information Storage and Handling (billions of 1986 dollars)
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From page 39... ...
39 Cal v ._ ._ so Ct ._ s~ o v v ._ o v o v o Cq v C~ .= ._ Ct v ._ V .O o .= Ct · ._ ~ ~ .o oc Ct Ct ~ ~ (,, Ct o~ s~ .o ~ o ~ o O V)
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From page 40... ...
A rapid evolution occurred in the electronics industry after the invention of the transistor and the monolithic integrated circuit: · Today's electronic equipment is filled with integrated circuits, interconnection boards, and other devices that are all manufactured by chemical processes. · The medium used for the transmission of information and data over distances has evolved from copper wire to optical fiber.
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From page 41... ...
. Chemical reactions and processes in the manufacture of microcircuits (Figure 4.3)
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From page 42... ...
Chemical process steps are important to the preparation of silicon materials, to the steps from oxidation of silicon wafers through establishment of bonding pads, and to the final assembly of chips in individual packages. Excerpted by special permission from Chemical Engineering, June 10, 1985.
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From page 43... ...
All these processes are based on chemical reactions that require precise process control to produce useful devices. Optical fibers are made by chemical processes.
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From page 44... ...
The resist film is removed after etching in preparation for other process steps. Excerpted by special permission from Chemical Engineering, June 10, 1985.
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From page 45... ...
One can envision a fiber manufacturing plant that moves from purification of chemical reagents to a series of chemical reactions, glassforming operations, and, finally, fiber-drawing steps. Intermediate products would never be removed from the production line.
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From page 46... ...
These manufacturing steps (i.e., materials synthesis, preparation and handling of uniform dispersions, coating, drying, and calendering) are chemical processes and/or unit operations that are familiar territory to chemical engineering analysis and design.
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From page 47... ...
Chemical processes are central to several of these steps. Excerpted by special permission from Encyclopedia of Chemical Technology, 3rd ea., Vol.
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From page 48... ...
This process must be carried out with exceptionally high yield, productivity, and reliability if the United States is to achieve a competitive advantage in the packaging of these devices. All modern interconnection devices are manufactured by chemical processes such as etching, film deposition, and ceramic forming.
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From page 49... ...
INTERNATIONAL COMPETITION In each of the technologies described in the preceding section, U.S. leadership in both fundamental research and manufacturing is severely challenged, and in some cases the United States is lagging behind its foreign competitors.
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From page 50... ...
Effort is being expended on equipment design for specific processing steps, but a parallel effort to integrate the processing of semiconductor materials and devices across the many individual steps has received less attention in both countries. Yet the latter effort may have signif icant payoffs in improved process reliability and efficiency- that is, in "manufacturability." The United States, with the strongest chemical engineering research community in the world, has the capability to take a significant lead in this area.
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From page 51... ...
Japan used to surpass the United States in the product uniformity of magnetic tape for professional applications; U.S. 51 firms have closed this gap in recent years and are now capturing worldwide market shares from the Japanese, even in Japan.
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From page 52... ...
If the United States is to maintain a competitive position in these industries, it is essential that it develop the fundamental knowledge necessary to stimulate further improvement of, and innovation in, processes involving chemical reactions that must be precisely controlled in a manufacturing environment. In the next section, the principal technical challenges are set forth.
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From page 53... ...
Thus, it becomes increasingly important to automate and integrate individual process steps into an overall manufacturing process. The concepts of chemical engineering are easily applied in meeting the challenge of process integration, particularly because many of the key process steps involve chemical reac , WAFER _ LASER ENTRY ~ READER Let i.
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From page 54... ...
This need is particularly acute for semiconductor materials and optical fibers. For semiconductor materials, the challenge is to find new, lower cost routes to ultrapure silicon and gallium arsenide and to purify other reagents used in the manufacturing process so that they do not introduce particulate contamination or other defects into the device being manufactured.
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From page 55... ...
Resists must be highly sensitive to the radiation used for exposure, but not to the microwave radiation used after development for other process steps such as plasma etching. Chemical engineering studies of polymer behavior during development steps are also needed.
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From page 56... ...
Chemical Synthesis and Processing of Ceramic Materials Challenges for chemical engineering related to ceramic materials are also discussed in Chapter 5, but the potential contribution of chemical engineers to this area cannot be emphasized too strongly. A tremendous opportunity exists for chemical engineers to apply their detailed knowledge of fundamental chemical processes in the development of new chemical routes to high-performance ceramics for electronic and photonic applications.
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From page 57... ...
New processing strategies and device structures are required that use compatible layers of materials to minimize undesirable phenomena such as contact resistance; electromigration; leakage currents; delamination; and stress-related defects such as cracks, voids, and pinholes. ~ , it, Modeling and the Study of Chemical Dynamics A challenge related to the problems of reactor design and engineering is the modeling and study of the fundamental chemistry occurring in manufacturing processes for semiconductors, optical fibers, magnetic media, and interconnection.
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From page 58... ...
For example, etching rates, etching selectivity, line profiles, deposited film structure, film bonding, and film properties are determined by a host of variables, including the promotion of surface reactions by ion, electron, or photon bombardment. The fundamental chemistry of these surface reactions is poorly understood, and accurate rate expressions are particularly needed for electron-impact reactions (i.e., dissociation, ionization, and excitation)
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From page 59... ...
These firms face important research problems in fundamental science and engineering that would benefit markedly from the insights of academic chemical engineering researchers. Academic researchers should seek out and forge links to these small firms that stand at the crucial step between laboratory research and production processes.
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From page 60... ...
FRONTIERS IN CHEMICAL ENGINEERING (d) Preliminary data from the 1986 survey of manufacturing industries provided by the NSF Division of Science Resources Studies.
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