The Future of Photovoltaics Manufacturing in the United States Summary of Two Symposia (2011) / Chapter Skim
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Panel V: Next Generation: The Flex Display Opportunity
Panel V: Next Generation: The Flex Display Opportunity
Pages 106-114
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From page 106... ...
The consortium was supported by DARPA, and Mr. Hartney was the DARPA program manager charged with the mission of building a supply capability in flat-panel displays in the United States.
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From page 107... ...
Some of these flexible electronic systems are arranged on ultrathin steel foil; other types of flexible electronics contain millions of transistors on a glass surface to control display pixels, or transistors on a plastic transparent substrate. Flexible and printed electronics represented "More than Moore," he said.
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From page 108... ...
Thin film has the advantage of leveraging LCD production and its $120 billion in sunk costs, and is being used experimentally on flexible substrates. The third generation of PV products is still in the R&D and pilot stages, with some scale-up work on organic, nanostructured materials, CIGS (copper indium gallium diselenide)
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From page 109... ...
Some fighter planes must be x-rayed after every mission to ensure that its carbon fiber material is still robust, a time-consuming process; much more efficient would be an integrated sensing grid that would instantly indicate whether the skin has to be replaced. Flexible skins may help outfit the "soldier of the future," with active camouflage, threat detection, and earth monitoring abilities; integrated solar energy sources; and these technologies could serve a dual use for similar requirements needed for first responders.
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From page 110... ...
Major programs at NIST laboratories include the Baldridge National Quality Program, Manufacturing Extension Partnership, and Technology Innovation Program (formerly the Advanced Technology Program)
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From page 111... ...
The Technology Innovation Program is one mechanism for catalyzing the transfer of technology to industry. For the later stage of rapid growth, NIST participates in standards development, tech transfer, and standard practices, as well as through the Manufacturing Extension Partnership (MEP)
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From page 112... ...
The efficiencies of devices change from line to line, under different conditions, without a great deal of control or understanding. NIST seeks to help reduce these basic unknowns through sophisticated measuring instruments that range from x-rays and synchrotrons to acoustic surface measurement and scanning tunneling microscopes.
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From page 113... ...
For example, in changing a display from glass substrates with amorphous silicon or polysilicon materials and photolithography, to a flexible printed device with new thin-film materials, many new options must be developed. Plastic, steel foil, and elastic substrates all have materials issues to be resolved, such as surface quality, barrier layers, and temperature limits.
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From page 114... ...
I think this country needs to take this funnel of research and technology that is presently directed toward Asia and move it back into the United States and ensure that we have an industry here that can be the manufacturing focus for the new technology."
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