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3 Government Promotional Efforts
Pages 59-70

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From page 59...
... The scope of these promotional efforts varies substantially between regions. In the United States, federal government support is generally regarded as appropriate for basic, generic research and basic infrastructure, whereas public support for the development of products and industrial processes can be controversial.
From page 60...
... . looking at a far broader range of printed components than is pursued in East Asia." European programs are promoting an extra­ rdinary o range of flexible electronics–based applications, including "smart packaging," printed flexible rechargeable batteries, radio frequency identifications, lighting systems, ubiquitous sensor networks for health care, smart textiles, and touch screens.3 In the East Asian countries Japan, Korea, China, and Taiwan, government promotional efforts in flexible electronics are heavily concentrated on development of flexible displays for consumer applications such as smartphones, TVs, and e-readers.
From page 61...
... states are supporting the establishment of flexible electronics innovation clusters to commercialize research results from local universities. In October 2013, the Canadian government announced a new promotional effort and an industrial consortium to foster the development of printed electronics technologies, involving a $40 million investment by the National Research Council of Canada over a 5-year period.
From page 62...
... ; cThe FP7-ICT Coordination Action OPERA, An Overview of OLAE Innovation ­ lusters C and Competence Centres, September 2011; dHouse of Commons, Universities, Science and Skills Committee, Engineering: Turning Ideas Into Reality I (March 18, 2009) , 33; e"Public and Industrial Agreements Enable Further Growth of Holst Centre," Holst Centre News Release, April 5, 2012; f"Building Activities Start on High Tech Campus Eindhoven," Solliance News Release, April 15, 2013; gGermany National Academy of Science and Engineering, Organic Electronics in ­ ermany: Assess G ment and Recommendations for Further Development, 2011, 8; hHouse of Commons, Innovation, Universities, Science and Skills Committees, Engineering: Turning Ideas Into Reality 1 (March 18, 2009)
From page 63...
... The FP7-ICT Coordination Action OPERA, An Overview of OLAE Innovation Clusters and Competence Centres, September 2011, 13. 10  Andres Hannah, The Global View of Printed Electronics and What it Could Mean to the U.S., September 24, 2010.
From page 64...
... Research collaborations with commercial objectives involving multiple firms and research organizations are inherently challenging, particularly in countries such as the United States, with a deeply embedded tradition of individualism, or South Korea, characterized by intense rivalry between industrial groups -- which underscores the value of examining other national models. In continental Europe, ­ longstanding industrial traditions of collaboration are currently buttressed by institutional arrangements for applied research, involving powerful financial 13  Craig Boardman and Denis Gray, "The New Science and Engineering Management: Cooperative Research Centers as Government Policies, Industry Strategies and Organizations," Journal of Technology Transfer, February 2010, 447.
From page 65...
... GOVERNMENT PROMOTIONAL EFFORTS 65 TABLE 3-2  Government-Supported Centers for Applied Research with Major Flexible Electronics Programs Source(s) of Country Research Center Government Support Themes US ASU Flexible Electronics Army, Arizona Military and dual use and Display Center applications US Akron Polymer Ohio Third Frontier Substrate, R2R, displays Innovation Center US CAMM Binghamton U DoD, New York R2R manufacturing US Western Michigan U Printed electronics CAPE US Georgia Tech COPE DoD, DoE, NSF Organic photonic materials/ devices Neth/Bel Holst Centre TNO, EU, Flanders OLED displays, lighting Neth/Bel IMEC TNO, EU, Flanders RFID, PV, foils Neth Solliance Brabant, TNO PV Fin PrintoCent VTT, Oulu R2R manufacturing UK Centre for Process TSB, One North East OLED lighting, PV, displays Innovation UK Printed Electronics ERDF, TSB, One OLED lighting, PV Technology Centre North East UK Welsh Centre for Printing EPSRC, TSB, FP7 Printing for flexible electronics and Coating UK Organic Materials EPSRC Biomaterials, packaging Innovation Centre UK Cambridge Integrated EPSRC PV, manufacturing Knowledge Centre Ger Fraunhofer COMEDD BMBF, ERDF, Saxony OLED lighting, R2R Ger Fraunhofer IAP BMBF, Land PV, OLED, signage, security applications Ger Fraunhofer ISC BMBF, Land Encapsulation technology Ger Fraunhofer FEP BMBF, Land R2R for flexible displays Ger Fraunhofer ENAS BMBF, Land RFIDs, flexible antennae, batteries Ger Fraunhofer EMFT BMBF, Land PV, sensors Ger Fraunhofer IIS BMBF, Land Textiles for medical, sports applications Ger Fraunhofer 1ZM BMBF, Land Electronic textiles Ger Fraunhofer ISIT BMBF, Land Bendable displays with memories continued
From page 66...
... 15 Government-supported cooperative research centers are frequently ­ roactive p in forming and shaping consortia. Taiwan's ITRI has not only organized industry alliances in flexible electronics but also assigned specific roles to individual participating companies.16 The European Union's Flex-o-Fab project, a 3-year 14  WTECH, European Research and Development in Hybrid Flexible Electronics (2010)
From page 67...
... The study observed that there were more than 17 OLAE clusters in Europe with more emerging and that at least 400 firms and institutions active in the field were ­ocated in these clusters.20 In a 2010 presentation on Korean initiatives l in flexible and printed electronics, Professor Changhee Lee of Seoul National University emphasized the nine innovation clusters of companies, research institutes, and universities that have emerged in South Korea in this sector. 21 The 17  "European Project Develops Flexible OLED Lighting Production Process," Plastic Electronics, February 8, 2013.
From page 68...
... The largest organic electronics cluster in Europe is in Dresden, where about 40 companies, 17 research institutes, and more than 950 ­ mployees e (as of 2012) are pursuing various research and innovation themes in organic electronics.23 (See Table 3-3.)
From page 69...
... TABLE 3-3  The Dresden Flexible Electronics Cluster R&D Production Supply Chain Tools/Plant Organic Displays/PV/lighting Materials Substrates Process Analytics Engineering TUD IAPP Novaled TU Dresden IAPP TU Dresden IAPP, FHR Anlagenbau Novaled AG Fraunhofer IZFP,COMEDD Fraunhofer Plastic Logic Fraunhofer, Fraunhofer, VON ARDENNE Heliatek GmbH COMEDD COMEDD, IPF, COMEDD, FEP IFW Fraunhofer FEP, Heliatek Liebnitz DTF Technology LEDON TU Dresden IWS Leibniz IPF LEDON Lighting Leitbniz IPF, IFW 3DMicromac Plastic Logic SEMPA SYSTEMS Organic electronics/RIFD Novaled AG Sunic System WOLFRAM Fraunhofer IPMS SAW Components Plastic Logic KSG Leiterplatten Design/ SURAGUS GmbH Engineering Fraunhofer Smartrac Heliatek Pm TUC Fraunhofer Fraunhofer IWS COMEDD COMEDD PE Sim4tec Fraunhofer FEP, Leibniz IPF, IFW IWS, COMEDD Ortner, AIS IHM, Sensient IWS, COMEDD AVT Plant Engineering TU Chemnitz T printechnologies Fraunhofer FEP, VON ARDENNE IWS DTF Technology 69 continued
From page 70...
... TABLE 3-3  Continued 70 R&D Production Supply Chain Tools/Plant Organic Displays/PV/lighting Materials Substrates Process Analytics Engineering FHR Antagenbau Creaphys 3DMicromac Sunic System Transport electrodes TUD IAPP Fraunhofer COMEDD, IWS, FEP Encapsulation TUD IAPP Fraunhofer COMEDD, FEP Printed Batteries TU Chemnitz TUD IAPP SOURCE: City of Dresden, Dresden -- Europe's Largest Cluster for Flexible Electronics (April 2012)


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