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Materials for High-Temperature Semiconductor Devices (1995) / Chapter Skim
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Conclusions and Recommendations
Pages 65-70

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From page 65...
... With the possible exception of LEDs, however, present commercial demand for wide bandgap semiconductor materials is limited. While there are few pressing applications that cannot be achieved without wide bandgap materials, the vast array of applications, and hence the value, will only be realized once these materials have evolved to such an extent that off-the-shelf devices are available.
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From page 66...
... This research area is synergistic with high-temperature applications because the generation of internal heat is a limiting factor in power devices and can be mitigated by larger bandgap and higher thermal conductivity materials. The dedication of European resources to this area is seen in the founding of the collaborative organization HITEN, which was established in 1992 to coordinate nascent European efforts in high-temperature electronics.
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From page 67...
... The pursuit of demonstration technologies would not only increase interest in wide bandgap materials, it would also provide significant testbeds for the application of the technology and enhance our understanding of the generic technologies recluired to further high-temperature device operation (e.g., materials etching and implantation; degradation modes of metallic gates, contacts, and interconnects at high temperatures; packaging behavior at high temperatures; and accelerated-testing and reliabilitytesting methodologies to ensure proper functioning)
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From page 68...
... Reduce defect density and background impurities Better control of n- and pipe doping New technologies for epitaxial growth Improve surface morphology Improve processing (CVD growth) Ohmic contacts Low contact resistance High-temperature contacts High-temperature packaging Improve understanding of basic properties and knowledge of design parameters Materials for High-Temperature Semiconductor Devices Technical Issues for SiC Purger improvement of crystal perfection (boule and CVD growth)
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From page 69...
... Greater understanding Is needed of the long-term effects Technical Issues for Packaging Improve reliability of high-temperature contacts Improve metallization Improve device development tools Improve process-control tools Improve polishing, cutting, mounting, and etching mends Develop reliability and aging tests Develop computer-aided design tools
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From page 70...
... · Computer-aided design tools: Computer-aided design tools are required that incorporate electrical and mechanical simulation of hightemperature electronic systems.
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Key Terms

  • bandgap materials
  • demonstration technologies
  • semiconductor materials
  • cvd growth
  • specific technical

  • key research
  • bandgap semiconductor
  • semiconductor devices
  • design parameters
  • crystal perfection

  • improve processing
  • packaging improve
  • switching devices
  • surface morphology
  • low contact

  • ohmic contacts
  • tools improve
  • growth improve
  • basic properties
  • defect density

  • reduce defect
  • improve understanding
  • provide significant
  • materials growth
  • sic wafers

  • earth elements
  • contact resistance
  • device reliability
  • rare earth
  • contacts low


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