Materials for High-Temperature Semiconductor Devices (1995) / Chapter Skim
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Backgorund
Backgorund
Pages 7-14
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From page 7... ...
Conventional vehicle architectures with an open-bottomed front engine compartment, generous underhood and underbody airflows, a metal heat-dissipating body and frame structure, and access to a water-cooling circuit leave very few locations within a vehicle that regularly achieve temperatures significantly above 100 °C. These locations are mainly near the exhaust system or brakes and can usually be avoided.
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From page 8... ...
Serious consideration is being given to sealing the engine compartment and moving the radiator to the rear of the vehicle. Fourth, replacement of metal body and frame components with composites of much lower thermal conductivity will eliminate many safe havens for electronics.
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From page 9... ...
Other Aerospace Applications Engines demand the highest temperature requirements for current aircraft, but temperature requirements will rise in many other critical areas as vehicle speed increases. A recent example is the control of the engine inlet guide vane for the high-speed civil transport, which requires that the moderately complex electronics driving the guide vane actuators operate for prolonged periods at 200 °C.
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From page 10... ...
Third, material and design factors that support high-temperature electronics operation would also enhance radiation hardness and increase resistance to upsets and damage from the unavoidable flux of cosmic radiation (Jurgens, 19821. Nuclear Power There are two types of nuclear power applications for wide bandgap semiconductors: those associated with reactor operation and these as.~nciated with handling processing, and storing of radioactive waste.
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From page 11... ...
There are many additional applications for small, high-torque electric motors besides motor vehicles. Such small motors will replace hydraulics in many applications once the reliability issues are settled, offering considerable design and control advantages and eliminating the weight of hydraulic fluid and the complexity of associated plumbing.
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From page 12... ...
Examples of purely immersion applications include reactor monitoring, well-logging, ride-through process monitoring, some nodes in aircraft or motor vehicle multiplex systems, and the Venus lander. In such applications, every component of the system must perform satisfactorily at the nominal operating temperature.
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From page 13... ...
To a first approximation, heat generated by power devices simply superimposes an internally generated gradient on the externally defined thermal environment and raises the nominal-device operating temperature accordingly. Power devices appear in both immersion and proximity applications.
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From page 14... ...
While silicon power devices may run into difficulties in ambient temperatures much above 100 °C, the low-power support electronics could easily be made to function at much higher temperatures. This strongly suggests a mixed technology consisting of silicon-based control electronics from the first category in support of power devices in a wide bandgap semiconductor technology.
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