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Executive Summary
Pages 1-6

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From page 1...
... Department of Defense and the National Aeronautics and Space Administration, the National Materials Advisory Board of the National Research Council convened the Committee on Materials for High-Temperature Semiconductor Devices to assess the national and international efforts to develop hightemperature semiconductors; to identify the technical barriers to their development and manufacture; to determine the criteria for successfully packaging and integrating new high-temperature semiconductors into existing systems; to recommend future research priorities; and to suggest additional, possible applications and advantages. 1 This Executive Summary is divided into two sections.
From page 2...
... wide bandgap materials research community is currently very competitive in the international research community. To remain competitive in the international research community, the committee recommends that demonstration technologies be pursued to motivate further research and increase interest in high-temperature semiconductor applications.
From page 3...
... The committee believes that the high-temperature research community should leverage the research funding for wide bandgap materials that is currently being provided by the high-power and optics markets, where no viable alternatives to wide bandgap materials currently exist. Building on the funding for other areas dependent on wide bandgap materials reduces the need for potential users of high-temperature devices to fund the required materials development exclusively and, thus, may render it cost effective.
From page 4...
... The three key research efforts for the development of commercially viable SiC devices are: · Wafer production: The 1- and 2- inch SiC wafers now in production are rapidly approaching device quality where they might be used for commercial production of devices and circuits with acceptable yield. It could be argued that such small wafers are entirely sufficient for what will be a relatively small market (compared with silicon)
From page 5...
... For high-temperature electronics to be commercially viable arut provide true performance 5 advantages, interconnection and packaging technologies are required that can reliably operate at temperatures up to 600 °Cfor 104 hours. To attain these goals, innovative packaging techniques will be required.


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