Database Needs for Modeling and Simulation of Plasma Processing (1996) / Chapter Skim
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Appendix A: Acronyms and Abbreviations
Appendix A: Acronyms and Abbreviations
Pages 59-60
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FTIR Fourier transform infrared FTMS Fourier transform mass spectroscopy IC integrated circuit ICE inductively coupled plasma TR infrared IRIS imaging of radicals interacting with surfaces lANAF Joint Army-Navy-Air Force In Knudsen number LIF laser-induced fluorescence MD molecular dynamics MOSFET metal oxide semiconductor field effect transistor MPU microprocessor unit NIST National Institute of Standards and Technology PECVD plasma-enhanced chemical vapor deposition PVD physical vapor deposition rf radio frequency RIE reactive ion etching SEM scar~nmg electron microscopy SEP stimulated emission pumping STA Semiconductor Industry Association SP:lE The International Society for Optical Engineering TALTF two-photon allowed laser-induced fluorescence TEM transmission electron microscopy TEOS tetraethoxysilane UHV ultrahigh vacuum ULST ultralarge-scaTe integration W ultraviolet VEST very large scale integration 59
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